Responsibilities：

1、Doinitialtests,carryoutnewmake–upsindependentlyandcollectalldataregardingcopperplatingprocessinPrintedCircuitBoardaswellasmakerecommendationsonmodificationtomaketheprocessmoresuitableforlocalmarket;

2、Supportmajortroubleshootingforneworexistingcopperplatingprocessincaseserioustroublehappensincustomersites;

3、CollectioninformationregardinganyimpacttoAtotechsalesandtechnicalperformanceofallAtotech’sproducts.Distributeittoappropriatecolleagues;

4、Transferknowhowtoprocessengineerorotherpersonnelworkinginthesameteam;

5、Contributetotheaccumulationofprocessknow–how,bealertandsensitivetoanynewknowledgeforexistingornewprocess.

Requirements：

1、Bachelordegreeorabove,majoredinChemistryorrelatedsubject;

2、Morethan oneyearsworkingexperienceincopperplatingprocessinPCBfield.